Increasing Demand for Efficient Cooling in Power Electronic Equipment

With the continuous advancement of modern mechanical and electronic technology, power electronic equipment is being used more extensively in critical areas such as national defense, military industry, and communications. These systems are evolving to become more compact, complex, and thermally dense, thereby increasing the demands on their cooling performance.

In large-capacity power electronic equipment, the heat generated by power devices is substantial, and traditional air-cooled radiators are often insufficient. Liquid cold plate, with their high efficiency, allow for a closer arrangement of devices, resulting in higher integration and a more compact structure. This efficient cooling method effectively addresses the heat dissipation challenges of large-capacity electronic devices.