Liquid Cold Plate

In power electronic control, conversion, drive, signal transmission, and new energy sectors—such as power battery cooling in new energy vehicles, heat dissipation for UPS and energy storage systems, large servers, photovoltaic inverters, and SVG/SVC systems—efficient, low-noise, and low-temperature operation is crucial. Limited space further complicates the issue of heat dissipation, making liquid cooling technology the preferred thermal management method.

Lori Thermal’s engineers bring extensive experience in water cooling system R&D and water cooling plate production. We offer comprehensive liquid cooling solutions, including thermal design, structural design, and water cooling system assembly. Our services are available at no cost, ensuring you receive expert support for your liquid cooling plate needs.



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Liquid Cooling Technology: An Efficient New Cooling Solution for Coping with the Surge in Computing Power

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Direct Chip Cooling Liquid Loop: A Technological Innovation Safeguarding High-Performance Computing

With the rapid development of technology, the computational demands of data centers, high-performance computing clusters, and artificial intelligence servers are growing increasingly. Traditional air-cooled heat dissipation methods have become insufficient for meeting the high-density and high-power dissipation requirements of modern chips. In response, direct to chip liquid cooling loop   technology  has emerged, becoming an indispensable heat dissipation solution in the field of high-performance computing due to its exceptional thermal conductivity, high heat dissipation efficiency, and low noise levels. Technical Characteristics direct to chip liquid cooling loop   technology, as its name implies, introduces coolant directly near the chip. Through an efficient heat exchange process, it quickly removes the heat generated by the chip. This technology not only significantly improves heat dissipation efficiency but also markedly reduces system noise, providing users with a...
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Liquid Cooling Loop: The Perfect Combination of Efficient Heat Dissipation and Leak-Proof Technology

As a crucial solution for heat dissipation in modern electronic devices, the design and maintenance of the liquid cooling loop  are of paramount importance. While pursuing efficient heat dissipation, minimizing or preventing condensation and leaks has always been our primary focus. Condensation is one of the common issues in liquid cooling loops. When the coolant temperature is lower than the ambient temperature, condensation may form on the cooling surface, which can drip onto electronic devices causing corrosion or accumulate at the bottom of the system leading to malfunctions. To address this, we have adopted advanced insulating materials to maintain the circuit temperature above the ambient dew point, effectively preventing condensation. In the design of the liquid cooling loop, we have fully considered the risk of leaks. To ensure the stable operation of the system, we cleverly position the reservoir and liquid circuit beneath the electronic devices. Even if a leak occurs, it ...
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