IT Communication Thermal Solution

3C products, also known as information home appliances, generally refer to computer, communication and consumer electronic products, with a wide variety of market demand, China has become the world's largest 3C product consumer market, with the improvement of national economic level and income level, the quality of electronic products also put forward higher requirements. Businesses have launched higher configuration, higher performance, better designed products to meet consumers.

 

There are many factors affecting the quality of electronic products, of which heat dissipation is a factor that can not be ignored, especially after the 2016 "Samsung battery gate" incident fermentation, electronic manufacturers pay more attention to the heat dissipation performance and safety of products. How can we ensure that the heat dissipation of electronic products meets the strict design requirements? Planning thermal management issues at the beginning of the product design cycle is a common approach to efficient thermal solutions. Lorithermal is a thermal technology service provider with more than ten years of experience, capable of providing thermal solutions for IT communication electronic products, involving: Board (motherboard) heat dissipation, CPU heat dissipation, graphics card heat dissipation, RF module heat dissipation, RU heat dissipation, game console heat dissipation, VR heat dissipation, industrial computer (machine) heat dissipation, server heat dissipation, central frequency conversion air conditioning heat dissipation, TEC heat dissipation and other fields.

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