What are the materials of liquid cold plates


Common liquid cold plate materials include copper, aluminum, stainless steel, plastic and so on.

Liquid cold plate is a kind of radiator material used for cooling electronic equipment. Its role is to dissipate the heat generated by the electronic equipment to ensure the stable operation of the equipment. The liquid cold plate usually consists of a series of heat sinks that absorb heat through the circulation of water and then transfer the heat to the outside.

The choice of liquid cold sheet material has an impact on the heat dissipation effect, stability and durability of the radiator. The following is the common liquid cold sheet material and its characteristics:

1. Copper

Copper is a traditional liquid cold plate material with excellent thermal conductivity and corrosion resistance, which can effectively transfer heat to water. However, copper products cost more and are more prone to rust and corrosion.

2. Aluminum

Aluminum is a lightweight liquid cold plate material, the cost is much lower than copper, and has good thermal conductivity and corrosion resistance. However, the rigidity of aluminum materials is poor, easy to deform, and special coolant is required.

3. stainless steel

Stainless steel is a kind of liquid cold plate material with good corrosion resistance, which is not easy to rust and has high durability. However, the thermal conductivity of stainless steel is poor and requires a longer cooling time.

4. Plastics

Plastic is a low-cost liquid cold plate material that is also light in weight and easy to process. However, plastic materials have poor thermal conductivity and are not suitable for high-performance water cooling systems.

In addition to the above common liquid cold plates, there are some other special materials, such as titanium alloy, carbon fiber and so on. These materials are generally used in some high-end electronic equipment heat dissipation.

In short, the selection of the appropriate liquid cold sheet material has a very important impact on the heat dissipation effect and stability of electronic equipment. You need to consider various factors according to the specific application scenario.

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