Cpu Cooler

Power Consumption Surges, Air Cooling Soon to Be Outdated In traditional general-purpose servers, the CPU is often the main contributor to computing power and also the "power hog" of the entire system. However, since entering the era of AI servers, AI accelerators such as GPUs and TPUs have become the primary sources of computing power. Although this architecturally reduces CPU power consumption, the power consumption per server rack has only increased. For instance, NVIDIA released the new-generation AI superchip GB200 this year, along with the GB200 NVL72 single-rack solution based on this chip. GB200 NVL72 represents NVIDIA's first server solution that fully embraces liquid cooling, given that the configuration of 36 CPUs + 72 GPUs exceeds 100kW in power consumption. Traditional air-cooling solutions struggle to maintain high cooling efficiency in the face of such high overall system power consumption, adversely impacting the power usage effectiveness (PUE) of entire A

With the continuous development and increasing complexity of embedded systems, the number of sensors and signals processed and analyzed is growing rapidly, which directly results in electronic devices generating more heat. Traditional air cooling methods have become inadequate in certain high-performance applications, prompting many engineers to turn to more efficient  direct to chip liquid cooling technology  to effectively remove this heat and ensure the stable operation of the system. When designing high-performance   direct to chip liquid cooling loops ,  several key points cannot be overlooked. The first is material compatibility. All materials and fluids used in the   liquid cooling loop  must be compatible with each other to avoid chemical reactions or corrosion, thereby ensuring the long-term stable operation of the system. Copper is the preferred material for many applications due to its excellent thermal conductivity and compatibility with most non-corrosive fluids. Aluminum

  The application of  liquid cooling technology  in electric vehicle (EV) batteries is primarily aimed at effectively managing the heat generated by the batteries during operation. When electric vehicle batteries are operating under high loads, such as during rapid acceleration or charging, they produce a significant amount of heat. If this heat is not effectively controlled and dispersed, it can lead to decreased battery performance, shortened battery life, and even pose safety risks. The following are the specific applications of liquid cooling   in electric vehicle batteries : Maintaining Stable Battery Temperature: The liquid cooling system helps maintain the battery pack's temperature within the optimal operating range. This is crucial for ensuring battery performance and extending battery life. Uniform Cooling: Liquid cooling can more evenly distribute the coolant to various parts of the battery pack, ensuring uniform temperature throughout the battery pack and avoiding local

With the rapid development of technology, the computational demands of data centers, high-performance computing clusters, and artificial intelligence servers are growing increasingly. Traditional air-cooled heat dissipation methods have become insufficient for meeting the high-density and high-power dissipation requirements of modern chips. In response, direct to chip liquid cooling loop   technology  has emerged, becoming an indispensable heat dissipation solution in the field of high-performance computing due to its exceptional thermal conductivity, high heat dissipation efficiency, and low noise levels. Technical Characteristics direct to chip liquid cooling loop   technology, as its name implies, introduces coolant directly near the chip. Through an efficient heat exchange process, it quickly removes the heat generated by the chip. This technology not only significantly improves heat dissipation efficiency but also markedly reduces system noise, providing users with a quieter and m

Liquid cooling loop technology  represents an advanced heat dissipation method. It leverages the high thermal conductivity of liquids to transfer heat from a heat source (such as electronic equipment) to a cooling device, effectively cooling the heat source. Compared to traditional air-cooled heat dissipation, liquid cooling loops offer higher heat dissipation efficiency, lower noise levels, and better stability, leading to their widespread application across various fields. The working principle of liquid cooling loops is relatively simple yet highly effective. It typically comprises key components including coolant, a liquid cooling plate, a pump, and a heat exchanger. Driven by the pump, the coolant circulates and exchanges heat with the heat source through the liquid cooling plate, carrying away the heat and transferring it to the heat exchanger. Ultimately, the heat is dissipated into the air through cooling fans or natural convection. Throughout this process, the coolant remains

As a crucial solution for heat dissipation in modern electronic devices, the design and maintenance of the liquid cooling loop  are of paramount importance. While pursuing efficient heat dissipation, minimizing or preventing condensation and leaks has always been our primary focus. Condensation is one of the common issues in liquid cooling loops. When the coolant temperature is lower than the ambient temperature, condensation may form on the cooling surface, which can drip onto electronic devices causing corrosion or accumulate at the bottom of the system leading to malfunctions. To address this, we have adopted advanced insulating materials to maintain the circuit temperature above the ambient dew point, effectively preventing condensation. In the design of the liquid cooling loop, we have fully considered the risk of leaks. To ensure the stable operation of the system, we cleverly position the reservoir and liquid circuit beneath the electronic devices. Even if a leak occurs, it can

  Concepts like 'AIGC in the field of artificial intelligence,' 'ChatGPT,' 'data special zones,' 'Eastern data and Western computing,' and 'data centers' are some of the hottest topics right now. Behind the surge in computing power, processor power consumption is increasing. To maximize processor performance, higher cooling efficiency is necessary.   With the explosive growth of computing power, we see an increase in power density and energy consumption in data centers. Traditional air cooling can no longer meet the growing cooling demands, highlighting the importance of   liquid cooling technology . The high power density of AI servers   makes 'liquid cooling' a cost-effective and efficient temperature control method.   Liquid cooling technology refers to the use of liquid instead of air as a coolant to exchange heat with heat-generating components and dissipate that heat. It involves directly introducing a liquid cooling system into the

With the rapid development of high-frequency, high-speed, and integrated circuit technology, the overall power density of electronic components has sharply increased, while their physical dimensions have become increasingly smaller. The resulting high-temperature environment inevitably affects the performance of electronic components, necessitating more effective thermal control methods. Addressing the heat dissipation issues of electronic components has become a key task.   1. Natural Cooling   Natural cooling refers to temperature control that occurs under natural conditions without relying on any external auxiliary energy. It involves the dissipation of heat from localized heating components to the surrounding environment through conduction, convection, and radiation. Among these, convection and natural convection are the primary methods used. Natural cooling is mainly suitable for applications with lower temperature control requirements, relatively low power density, and low-power

The liquid cooling plate heat sink is an innovative and highly efficient cooling device, widely applied in various electronic devices and industrial fields. It employs water cooling technology, rapidly and effectively transferring heat from the heat source to the heat sink through the circulation of water, thereby achieving a cooling effect. The working principle of the liquid cooling plate heat sink is quite simple. It consists of sealed pipes filled with water internally. When the heat source generates heat, the water flows within the pipes, absorbing heat through contact with the heat source. Subsequently, the heated water flows near the heat sink, dissipating the heat through it. Afterward, the cooled water recirculates back near the heat source, completing a closed-loop cycle. Compared to traditional cooling methods, liquid cooling plate  heat sinks offer numerous advantages. Firstly, they possess high-efficiency cooling capabilities. Water exhibits excellent thermal conductivity,