Design of High-Performance Direct to Chip Liquid Cooling Loop

With the continuous development and increasing complexity of embedded systems, the number of sensors and signals processed and analyzed is growing rapidly, which directly results in electronic devices generating more heat. Traditional air cooling methods have become inadequate in certain high-performance applications, prompting many engineers to turn to more efficient direct to chip liquid cooling technology to effectively remove this heat and ensure the stable operation of the system.

When designing high-performance direct to chip liquid cooling loops, several key points cannot be overlooked. The first is material compatibility. All materials and fluids used in the liquid cooling loop must be compatible with each other to avoid chemical reactions or corrosion, thereby ensuring the long-term stable operation of the system. Copper is the preferred material for many applications due to its excellent thermal conductivity and compatibility with most non-corrosive fluids. Aluminum is compatible with various fluids such as PAO, oil, and ethylene glycol water solution (EGW), and also has a wide range of application prospects. Stainless steel, on the other hand, is an ideal choice for certain special applications due to its compatibility with corrosive fluids, including deionized water.

Corrosion prevention is another crucial aspect. Corrosion can not only lead to material damage and leaks but also clog fluid channels or filters, severely affecting system performance. To minimize electrochemical corrosion and erosion-corrosion, engineers need to take a series of measures, such as using similar materials or non-conductive fluids to prevent electrochemical corrosion and minimizing erosion-corrosion by improving pipeline design and material selection.

Condensation issues also require special attention during the design process. When using coolant below ambient temperature, condensation may form on cold surfaces, which can not only damage equipment but also pose a series of safety issues. To avoid this, the surface temperature can be maintained above the ambient dew point by insulating the surface or using a higher fluid temperature. Various insulating materials provided by companies like Lori are effective means of addressing this issue.

The selection of joints, connectors, and fittings is equally important. Excessive joints can increase the risk of leaks, so the number of joints should be minimized in cold plates or heat exchangers. At the same time, choosing the right joints and using them correctly is also key to preventing leaks. Lori's O-ring product portfolio and expertise can provide engineers with the correct material, certification, and size selection to ensure system sealing.

Finally, when designing direct to chip liquid cooling loops, the needs for maintenance and service must also be fully considered. This includes pump lubrication requirements, fluid replenishment, field-replaceable components, maintenance schedules, and pump service life. To ensure smooth future operation, all members of the design, operations, and maintenance teams should be involved in the decision-making process.

In summary, when designing standard or custom direct to chip liquid cooling loops, it is essential to comprehensively consider material compatibility, corrosion prevention, condensation control, the location of the liquid cooling loop, standard and custom components, joints, connectors, hoses, as well as maintenance and service requirements. Only when liquid cooling technology is correctly integrated into the system can it provide efficient heat removal and low risk, ensuring the stable operation of electronic devices in complex and high-performance applications.